Research on the Application of Polymer Materials in Electronic Packaging

Abstract

Polymer materials, as core materials in modern electronic packaging, are widely used for protecting and supporting electronic components due to their excellent electrical insulation, good mechanical properties, and processing flexibility. With the development of electronic products toward high-density integration, miniaturization, and high performance, traditional packaging materials face performance bottlenecks. The multifunctionalization and performance optimization of polymer materials have become key to improving the reliability and service life of electronic packaging. This paper comprehensively analyzes the application characteristics of polymer materials such as epoxy resin, polyimide, and thermally conductive polymer composites in electronic packaging, focusing on the optimization methods for mechanical, electrical, and thermal properties. Through studies on polymer material structure design, composite modification, and nano-filler reinforcement technologies, the mechanisms of performance enhancement and their promotion of packaging technology are revealed. Research shows that polymer materials not only meet the basic requirements of mechanical protection and electrical insulation for electronic device packaging but also effectively solve the heat dissipation problem in packaging, improving the overall system stability. This study holds significant theoretical value and practical significance for advancing electronic packaging material technology and enhancing the reliability and performance of electronic products.